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What is the relationship between the curing time and temperature of silicone adh

03 Dec 2025

The curing time of silicone adhesives at high temperatures is closely related to temperature.

Generally, as temperature increases, molecular motion in the adhesive intensifies, accelerating the cross-linking reaction and thus shortening the curing time.

Therefore, using silicone adhesives at high temperatures can significantly reduce curing time and improve production efficiency.

However, excessively high temperatures can also cause the adhesive to cure too quickly, leading to problems such as internal stress concentration and residual bubbles, affecting the bonding effect.

Therefore, when selecting the curing temperature, factors such as the adhesive formulation, thickness, operating environment, and required curing strength need to be comprehensively considered.

Generally, manufacturers provide recommended curing temperature ranges and times; users should select according to their specific circumstances.

In practice, the optimal combination of curing time and temperature can be determined through experimentation.

Apply the adhesive to the materials to be bonded, and then conduct curing tests under different temperature conditions, observing and recording the curing time, post-curing appearance, and performance indicators.

Through comparative analysis, curing conditions that meet both performance requirements and ensure production efficiency can be selected.

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